The Dimensity 9000, a first-generation 4nm flagship chipset from MediaTek, was unveiled in November of last year. An Arm Cortex-X2 primary core, three Cortex-A710 performance cores, four Cortex-A510 efficiency cores, and a Mali-G710 GPU were all included in the octa-core chipset.
Additionally, it included an 18-bit Image Signal Processor and MediaTek’s 5th generation AI processing unit (APU) (ISP). The new Dimensity 9000 Plus appears to be a small boost compared to the Dimensity 9000, which significantly outperformed MediaTek’s prior flagship processor.
MediaTek today revealed a mid-cycle upgrade for its most recent flagship chipset, following Qualcomm’s lead. The new Dimensity 9000 Plus is essentially the same chip with a faster prime core, whereas the Snapdragon 8 Plus Gen 1 introduced a number of notable modifications. For a side-by-side comparison, see the table below.
MediaTek Dimensity 9000 Plus: Specifications
| Specification | MediaTek Dimensity 9000 Plus | MediaTek Dimensity 9000 |
|---|---|---|
| Manufacturing process | TSMC’s 4nm-class process | TSMC’s 4nm-class process |
| CPU | 1x Arm Cortex-X2 @ 3.2GHz3x Arm Cortex-A710 @ 2.85GHz4x Arm Cortex-A510 (clock speed not specified) | 1x Arm Cortex-X2 @ 3GHz3x Arm Cortex-A710 @ 2.85GHz4x Arm Cortex-A510 @ 1.8GHz |
| GPU | Arm Mali Mali-G710 MC10 GPU | Arm Mali Mali-G710 MC10 GPU |
| Display | Maximum On-Device Display support:FHD+ @ 180HzWQHD+ @144Hz MediaTek Intelligent Display Sync 2.0 | Maximum On-Device Display support:FHD+ @ 180HzWQHD+ @144Hz MediaTek Intelligent Display Sync 2.0 |
| AI | 5th Gen APU 5904x power efficiency over the previous generation | 5th Gen APU 5904x power efficiency over the previous generation |
| Memory | LPDDR5X (up to 7500Mbps) | LPDDR5X (up to 7500Mbps) |
| ISP | 18-bit HDR ISP4K HDR video on 3 cameras simultaneouslySuper Night Video Recording320MP camera support | 18-bit HDR ISP4K HDR video on 3 cameras simultaneouslySuper Night Video Recording320MP camera support |
| Modem | Integrated multimode 5G/4G modemSub-6GHzDownlink: 7Gbps3CC Carrier Aggregation (300MHz)MediaTek 5G UltraSave 2.0 | Integrated multimode 5G/4G modemSub-6GHzDownlink: 7Gbps3CC Carrier Aggregation (300MHz)MediaTek 5G UltraSave 2.0 |
| Connectivity | Bluetooth 5.3 (BLE Audio-ready)Wi-Fi 6E 2×2 (BW160)Wireless Stereo AudioBeidou III-B1C GNSS support | Bluetooth 5.3 (BLE Audio-ready)Wi-Fi 6E 2×2 (BW160)Wireless Stereo AudioBeidou III-B1C GNSS support |
As you can see, MediaTek’s new Dimensity 9000 Plus doesn’t have any notable updates. However, that doesn’t necessarily imply that the new chip won’t improve performance in the real world.
According to MediaTek, the new chip offers a 5 percent increase in CPU performance and a 10% increase in GPU performance when compared to the Dimensity 9000, which could lead to some improvements in real-world performance. Read More; AMD Ryzen 7000: Everything We Know About Zen 4 CPUs
But it’s possible that the distinction won’t be as noticeable as it was between the Snapdragon 8 Gen 1 and Snapdragon 8 Plus Gen 1. As soon as new phones with the Dimensity 9000 Plus are available, we’ll be sure to put this to the test. Read also; AMD Ryzen 6000 Series: Everything You Need to Know
About that, MediaTek says that devices with its latest flagship chipset will hit the market in the third quarter of 2022. The company hasn’t said who will use the chips in their upcoming flagship devices. We don’t think the list will be too long since the Dimensity 9000 hasn’t been on many devices either. So far, only OPPO and Vivo have released phones with MediaTek’s previous flagship chipset. This is likely because most buyers still prefer Qualcomm’s Snapdragon chipsets in the premium smartphone segment. Read Also; Apple M2 Chip might not the Next-Gen
What do you think about the new MediaTek Dimensity 9000 Plus? Do you think it’s a welcome upgrade or just a marketing ploy to keep up with Qualcomm’s top-of-the-line products? Tell us what you think in the comments section below.
